Wafer diamond dicing blade with hub

FOB Reference Price:Get Latest Price
US $30-50 / Piece | 1 Piece/Pieces (Min. Order)
Supply Ability:
4000 Piece/Pieces per Month
Port:
zhengzhou
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Overview
Quick Details
Place of Origin:
Henan, China (Mainland)
Brand Name:
Yinwang
Type:
Abrasive Disc
Size:
12A2 25*640-3000-70-M
Packaging & Delivery
Packaging Details
small plastic box
Delivery Time
within 7 days

Description:

Electroplated bond blades with hub are used to groove , cut and dice silicon, GaAs, glass, ceramic, quartz and compound semiconductor material wafer in integrated chips and discrete devices production. This product has high precision and long life span. Its performance has achieved abroad advanced level.

 

Five important parameters choose dicing blade

1. diamodn grit

2.length of blade edge

3.thickness of blade edge

4.style of adhesive

5.styles of diamond concentration

 

Application scope:

Silicon wafer, GaAs, GaP, sapphire, ceramic

 

basic parameters of dicing blades.

 

For more information, welcome to contact me:

 

skype ID: stelerhi

Mobile: 0086 18339244861

wechat: XH947177795