Wafer diamond dicing blade with hub

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US $30-50 / Pieces | 1 Piece/Pieces (Min. Order)
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Quick Details
Place of Origin:
Henan, China (Mainland)
Brand Name:
Abrasive Disc
12A2 25*640-3000-70-M
Supply Ability
Supply Ability:
4000 Piece/Pieces per Month
Packaging & Delivery
Packaging Details
small plastic box
Lead Time :
within 7 days


Electroplated bond blades with hub are used to groove , cut and dice silicon, GaAs, glass, ceramic, quartz and compound semiconductor material wafer in integrated chips and discrete devices production. This product has high precision and long life span. Its performance has achieved abroad advanced level.


Five important parameters choose dicing blade

1. diamodn grit

2.length of blade edge

3.thickness of blade edge

4.style of adhesive

5.styles of diamond concentration


Application scope:

Silicon wafer, GaAs, GaP, sapphire, ceramic


basic parameters of dicing blades.


For more information, welcome to contact me:


skype ID: stelerhi

Mobile: 0086 18339244861

wechat: XH947177795